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XCZU57DR-2FFVE1156I

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Stock: In Stock

Shipping Method: LCL, AIR, FCL, Express

Description: IC ZUP RFSOC A53 FPGA 1156BGA

Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram

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Hervorheben:
Category:
Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status:
Active
Peripherals:
DDR, DMA, PCIe, WDT
Primary Attributes:
Zynq® UltraScale+™ RFSoC
Series:
Zynq® UltraScale+™ RFSoC DR
Package:
Tray
Mfr:
AMD
Supplier Device Package:
1156-FCBGA (35x35)
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
-40°C ~ 100°C (TJ)
Architecture:
MPU, FPGA
Package / Case:
1156-BBGA, FCBGA
Number of I/O:
-
RAM Size:
-
Speed:
533MHz, 1.3GHz
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:
-
Category:
Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status:
Active
Peripherals:
DDR, DMA, PCIe, WDT
Primary Attributes:
Zynq® UltraScale+™ RFSoC
Series:
Zynq® UltraScale+™ RFSoC DR
Package:
Tray
Mfr:
AMD
Supplier Device Package:
1156-FCBGA (35x35)
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
-40°C ~ 100°C (TJ)
Architecture:
MPU, FPGA
Package / Case:
1156-BBGA, FCBGA
Number of I/O:
-
RAM Size:
-
Speed:
533MHz, 1.3GHz
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:
-
XCZU57DR-2FFVE1156I
Quad ARM® Cortex®-A53 MPCoreTM mit CoreSightTM, Dual ARM®CortexTM-R5 mit CoreSightTM System On Chip (SOC) IC Zynq® UltraScale+TM RFSoC DR Zynq® UltraScale+TM RFSoC 533MHz, 1.3GHz 1156-FCBGA (35x35)
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